Description
1. Model-S is used to get the hard disk from the CPU IC.
2. Model-E is used to remove glue from CPU IC of mobile phone motherboard.
3. Professional Edge Model-X Glue Removal Tool.
4. Model-Y cuts off the black glue without damaging the board.
5. Non-slip and labor-saving design, ergonomic grip, comfortable.
2. Model-E is used to remove glue from CPU IC of mobile phone motherboard.
3. Professional Edge Model-X Glue Removal Tool.
4. Model-Y cuts off the black glue without damaging the board.
5. Non-slip and labor-saving design, ergonomic grip, comfortable.
Paiements sécurisés
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